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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4W2G1646P-HC12 K4W2G1646P-HC12 K4W2G1646P-HC12 SAMSUNG DIP 23+ 2680 View
K9F1G08UOE-SIBO K9F1G08UOE-SIBO K9F1G08UOE-SIBO SAMSUNG TSOP24 23+ 2676 View
K9F1G08U0E-SIB0 K9F1G08U0E-SIB0 K9F1G08U0E-SIB0 SAMSUNG BGA 23+ 2676 View
K4T56163QO-BCE7 K4T56163QO-BCE7 K4T56163QO-BCE7 SAMSUNG DIP 23+ 2676 View
K8P2815UQB-DI4B K8P2815UQB-DI4B K8P2815UQB-DI4B SAMSUNG TSOP 23+ 2672 View
KA34063AD-STF KA34063AD-STF KA34063AD-STF SAMSUNG BGA 23+ 2672 View
K4T51163QG-HCE70DT K4T51163QG-HCE70DT K4T51163QG-HCE70DT SAMSUNG Mainplate 23+ 2672 View
KMQ8X000SA-B414 KMQ8X000SA-B414 KMQ8X000SA-B414 SAMSUNG TSOP 23+ 2668 View
K9F8G08U0M-PIB0 K9F8G08U0M-PIB0 K9F8G08U0M-PIB0 SAMSUNG FBGA153 23+ 2668 View
K4E2E304EE-AGCE K4E2E304EE-AGCE K4E2E304EE-AGCE SAMSUNG SOJ 23+ 2668 View
K3N6V148DE-GC12T00 K3N6V148DE-GC12T00 K3N6V148DE-GC12T00 SAMSUNG BGA 23+ 2668 View
KMFE60012M-B214 KMFE60012M-B214 KMFE60012M-B214 SAMSUNG TSOP 23+ 2664 View
K9F2G08UOA-PCBO K9F2G08UOA-PCBO K9F2G08UOA-PCBO SAMSUNG TSSOP 23+ 2664 View
K4UBE3D4AM-MGCJ K4UBE3D4AM-MGCJ K4UBE3D4AM-MGCJ SAMSUNG TSOP48 23+ 2664 View
K6T1008C2E-DB55 K6T1008C2E-DB55 K6T1008C2E-DB55 SAMSUNG TSOP44 23+ 2664 View
KM416S1120AT-G12 KM416S1120AT-G12 KM416S1120AT-G12 SAMSUNG BGA 23+ 2660 View
K9WAG08U1A-PIB0 K9WAG08U1A-PIB0 K9WAG08U1A-PIB0 SAMSUNG BGA 23+ 2660 View
K4M56163PI-BG-75 K4M56163PI-BG-75 K4M56163PI-BG-75 SAMSUNG SOJ 23+ 2660 View
K4S51163PF-PF75 K4S51163PF-PF75 K4S51163PF-PF75 SAMSUNG BGA 23+ 2660 View
K4T51083QG-HCE7 K4T51083QG-HCE7 K4T51083QG-HCE7 SAMSUNG BGA 23+ 2660 View