SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4H560838J-LCCC	SAMSUNG	BGA	23+	2695	View
K4S281632K-UL75	SAMSUNG	TSOP	23+	2695	View
K4S641632N-LI75	SAMSUNG	DIP-16	23+	2695	View
K4B1G1646E-HCH9	SAMSUNG	TSSOP	23+	2695	View
K4B2G1646F-BMK0	SAMSUNG	BGA	23+	2695	View
K4D551638F-TC40	SAMSUNG	BGA	23+	2695	View
K4T51083QC-ZCE6	SAMSUNG	BGA	23+	2695	View
K9F1G08U0A-PCBO	SAMSUNG	TSOP48	23+	2692	View
K9F1208U0C-JIB0	SAMSUNG	NA	23+	2692	View
K4T51163QG-HCF8	SAMSUNG	BGA	23+	2692	View
K8P1615UQB-PI4B	SAMSUNG	BGA	23+	2688	View
K9F2G08UOB-PCBO	SAMSUNG	NA	23+	2688	View
K4S64323LH-HN75	SAMSUNG	BGA	23+	2688	View
K4T1G164QF-BCF7	SAMSUNG	BGA-95	23+	2688	View
K9F4G08U0M-PIB0	SAMSUNG	TSOP	23+	2688	View
KM62256CLTG-7L	SAMSUNG	TSOP48	23+	2684	View
K9F5608R0D-JIB0	SAMSUNG	PLCC	23+	2684	View
K4J52324QE-BC14	SAMSUNG	PLCC-44	23+	2684	View
KLM4G1FETE	SAMSUNG	TSOP	23+	2680	View
K9K8G08U0M-PCB0	SAMSUNG	DIP-28	23+	2680	View

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