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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4M56163PE-BG1L K4M56163PE-BG1L K4M56163PE-BG1L SAMSUNG TSOP48 23+ 2732 View
K9GAG08UOD-PCB0 K9GAG08UOD-PCB0 K9GAG08UOD-PCB0 SAMSUNG TSOP48 23+ 2728 View
K9MDG08U5M-PIB0 K9MDG08U5M-PIB0 K9MDG08U5M-PIB0 SAMSUNG TSOP44 23+ 2728 View
K4T1G164QF-BIF7 K4T1G164QF-BIF7 K4T1G164QF-BIF7 SAMSUNG TSOP-48 23+ 2728 View
K7I323682M-FC25 K7I323682M-FC25 K7I323682M-FC25 SAMSUNG TSOP48 23+ 2728 View
KLM8G1GETF-B041 KLM8G1GETF-B041 KLM8G1GETF-B041 SAMSUNG DIP32 23+ 2728 View
K9F1G08UOB-SCBD K9F1G08UOB-SCBD K9F1G08UOB-SCBD SAMSUNG DIP-42 23+ 2724 View
KCAE0AE00M-B505 KCAE0AE00M-B505 KCAE0AE00M-B505 SAMSUNG SMD 23+ 2724 View
K4S561632B-UC60 K4S561632B-UC60 K4S561632B-UC60 SAMSUNG TSOP 23+ 2724 View
K9F1208UOA-PCBO K9F1208UOA-PCBO K9F1208UOA-PCBO SAMSUNG TSSOP 23+ 2720 View
KM681000CLG-7L KM681000CLG-7L KM681000CLG-7L SAMSUNG BGA 23+ 2720 View
K4A4G085WE-BCPB K4A4G085WE-BCPB K4A4G085WE-BCPB SAMSUNG TSOP 23+ 2720 View
KA7002024C-AE33 KA7002024C-AE33 KA7002024C-AE33 SAMSUNG BGA 23+ 2720 View
K9G4G08UOA-PIB0 K9G4G08UOA-PIB0 K9G4G08UOA-PIB0 SAMSUNG BGA 23+ 2720 View
K6X4016T3F-UF70 K6X4016T3F-UF70 K6X4016T3F-UF70 SAMSUNG BGA 23+ 2720 View
K511F58ACA-A075 K511F58ACA-A075 K511F58ACA-A075 SAMSUNG TSOP32 23+ 2720 View
K511F58ACC-B075 K511F58ACC-B075 K511F58ACC-B075 SAMSUNG TSOP32 23+ 2720 View
KS57C3016-50 KS57C3016-50 KS57C3016-50 SAMSUNG BGA 23+ 2716 View
KS51840-10DTF KS51840-10DTF KS51840-10DTF SAMSUNG TSOP48 23+ 2716 View
K4H511638G-HCCC K4H511638G-HCCC K4H511638G-HCCC SAMSUNG SOP32 23+ 2716 View