SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
KMVTU000LM-B503	SAMSUNG	SSOP	23+	2712	View
K9WAG08U1D-SIB0	SAMSUNG	BGA	23+	2712	View
K4T51163QC-GCD5	SAMSUNG	TSOP	23+	2712	View
KM62256DLG-5	SAMSUNG	TSOP44	23+	2708	View
K9WAG08U1A-PIBO	SAMSUNG	DIP18	23+	2708	View
K4S641632H-TC75	SAMSUNG	TSOP	23+	2708	View
KBY00N00HM-A448	SAMSUNG	TSOP	23+	2704	View
KM4164B-12	SAMSUNG	FBGA63	23+	2704	View
K4S560832H-UC75	SAMSUNG	SSOP	23+	2704	View
KLMBG4GEUF-B04P	SAMSUNG	TSOP	23+	2704	View
K4H511638F-LCC	SAMSUNG	BGA	23+	2704	View
K9WAG08U1D-SIB000	SAMSUNG	TSOP-44P	23+	2700	View
KST56-MTF	SAMSUNG	BGA	23+	2700	View
K4J52324QE-BJ1A	SAMSUNG	TSOP40	23+	2700	View
KLMAG1JETD-B041	SAMSUNG	TSOP	23+	2700	View
K3PE8E400B-XGC0	SAMSUNG	DIP	23+	2700	View
K9F1G08U0BPCB0	SAMSUNG	SOP32	23+	2696	View
K9F1G08U0D-BIB0	SAMSUNG	BGA	23+	2696	View
K4X51163PC-FGCA	SAMSUNG	PLCC44	23+	2696	View
K4T56163QN-HCF7	SAMSUNG	DIP-20	23+	2695	View

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