SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4X51323PK-NGD8	SAMSUNG	BGA	23+	2660	View
K4B2G16460-BYK0	SAMSUNG	TSSOP	23+	2660	View
K4B2G1646C-HCNB	SAMSUNG	QFP	23+	2660	View
K4B2G1646C-HCH9	SAMSUNG	SMD-32	23+	2660	View
K4D261638I-LC40	SAMSUNG	TSOP	23+	2660	View
K7N163631B-PC1600	SAMSUNG	TSOP20	23+	2660	View
KLUEG8U1EM-B0B1	SAMSUNG	SOP	23+	2656	View
KA3883CD	SAMSUNG	BGA	23+	2656	View
K4M51163PC-BG75T00	SAMSUNG	BGA	23+	2656	View
K4G323222A-PC50	SAMSUNG	DIP-18	23+	2656	View
KLUDG8J1EB-B0B1	SAMSUNG	BGA	23+	2652	View
KSC1623-G	SAMSUNG	BGA	23+	2652	View
K4J55323QF-GC16	SAMSUNG	BGA	23+	2652	View
KLM4G1FETE-B041	SAMSUNG	BGA-162	23+	2648	View
KM616FU2010AZI-10	SAMSUNG	TSOP-40	23+	2648	View
K4S643232H-TC50	SAMSUNG	DIP-32	23+	2648	View
K9WAG08U1A-PIB0T	SAMSUNG	DIP	23+	2644	View
K9F1G08UOD-BIBO	SAMSUNG	FBGA	23+	2644	View
K4S643232F-TC60	SAMSUNG	BGA	23+	2644	View
K9G4G08U0A-PIB0	SAMSUNG	FBGA	23+	2640	View

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