SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
KSA733-Y	SAMSUNG	TSOP56	23+	2640	View
K4T1G084QF-BCE7	SAMSUNG	TSOP48	23+	2640	View
KM681000BLG-7L	SAMSUNG	FBGA	23+	2640	View
K4N56163QG-ZC2A	SAMSUNG	BGA	23+	2639	View
K4T51043QE-ZCE6	SAMSUNG	BGA	23+	2639	View
K4T51163QQ-BCE7	SAMSUNG	BGA	23+	2639	View
K4S281632K-UC75	SAMSUNG	TSOP	23+	2639	View
K4B1G1646I-BCKO	SAMSUNG	TSOP	23+	2639	View
K4B2G1646C-HCMA	SAMSUNG	TQFP100	23+	2639	View
K4D623238F-QC50	SAMSUNG	BGA	23+	2639	View
K9F6408U0M-TCBO	SAMSUNG	ZIP-9	23+	2636	View
K9F4G08U0M-PCB0	SAMSUNG	FBGA63	23+	2636	View
K4A8G165WC-BCRC	SAMSUNG	TSOP48	23+	2636	View
KM684000BLGI-7L	SAMSUNG	TSOP48	23+	2632	View
K9F2G08ROA-JIBO	SAMSUNG	FBGA153	23+	2632	View
K4P4G324EB-AGC1	SAMSUNG	TSSOP	23+	2632	View
K5E1212ACC-D075T	SAMSUNG	TSOP	23+	2632	View
K5R2G1GACC-AL75	SAMSUNG	LBGA	23+	2632	View
K7B403625M-QC90	SAMSUNG	DIP16	23+	2632	View
K3MF8F80DM-MGCF	SAMSUNG	TSOP	23+	2632	View

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