SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3C2451X53-YY40	SAMSUNG	BGA	23+	1752	View
S3C2410A26-Y08N	SAMSUNG	BGA	23+	1752	View
CIM10U800NC	SAMSUNG	BGA	23+	1752	View
S1A0903X01-Q080	SAMSUNG	FBGA84	23+	1752	View
CL10C360JB8NNNC	SAMSUNG	FBGA60	23+	1752	View
CL21F225ZOFNNNE	SAMSUNG	178FBGA	23+	1752	View
CL10B471KB8NNNC	SAMSUNG	BGA	23+	1752	View
CL21C100JBANNNC	SAMSUNG	TSOP	23+	1752	View
CL31B102KHFSFNE	SAMSUNG	BGA	23+	1752	View
CL10B472KC85PNC	SAMSUNG	TSSOP	23+	1752	View
CIH10TR15JNC	SAMSUNG	BGA200	23+	1752	View
CIGT252010LMR68MNE	SAMSUNG	TSOP-54	23+	1752	View
SC32442A31-7080	SAMSUNG	BGA	23+	1748	View
BC850-BTF	SAMSUNG	BGA	23+	1748	View
SPMWHD32AMDPVAUSSK	SAMSUNG	TSOP66	23+	1748	View
HV9963NG-G	SAMSUNG	BGA	23+	1748	View
S6A2067X01-QO	SAMSUNG	FBGA-60	23+	1748	View
S6D0129X01-B0CY	SAMSUNG	BGA	23+	1748	View
S6TNMR1X01-Y040	SAMSUNG	TSOP	23+	1748	View
LQW15AN82NG00D	SAMSUNG	BGA	23+	1744	View

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