SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
R801716VTC-TI07	SAMSUNG	TSSOP	23+	1700	View
SFHG42MQ101	SAMSUNG	BGA	23+	1700	View
TCSCS1D336MCAR	SAMSUNG	BGA44	23+	1700	View
SC5C111AAX-A040	SAMSUNG	BGA	23+	1700	View
VMTICS02580675518	SAMSUNG	BGA	23+	1700	View
S5L9294X02-Q080	SAMSUNG	BGA	23+	1700	View
S5L9278X01-T080	SAMSUNG	BGA	23+	1700	View
S3C2416XH-40	SAMSUNG	FBGA	23+	1700	View
S3P22BAZZ-QZ88	SAMSUNG	BGA	23+	1700	View
S3C9428X16-COC4	SAMSUNG	FBGA	23+	1700	View
S3C2510A01L	SAMSUNG	NA	23+	1700	View
CIL10NR10KNE	SAMSUNG	FBGA	23+	1700	View
S1L9223B01-00	SAMSUNG	BGA	23+	1700	View
CL10B333KBNC	SAMSUNG	BGA	23+	1700	View
CL32B106KOULNNE	SAMSUNG	BGA	23+	1700	View
CL03C180JA3NNNC	SAMSUNG	TSSOP	23+	1700	View
CL05A105KO5NNNC	SAMSUNG	BGA	23+	1700	View
CL05B271KB5NNNC	SAMSUNG	FBGA	23+	1700	View
CL21B471KBANNNC	SAMSUNG	TSOP	23+	1700	View
CL10A106KQ8NNNC	SAMSUNG	TSOP24	23+	1700	View

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