SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
TCSCN1E106MDAR	SAMSUNG	FBGA	23+	1740	View
HE12AF1U11	SAMSUNG	BGA200	23+	1736	View
MZILT3T8HBLS-00007	SAMSUNG	FBGA	23+	1736	View
S3C8245X28-QWR5	SAMSUNG	BGA	23+	1736	View
SAFEA1G58KA0F00R15	SAMSUNG	TSOP	23+	1732	View
ES8393ASA	SAMSUNG	TSOP	23+	1732	View
SE857MH-NT	SAMSUNG	BGA	23+	1732	View
AMAN402012SS106	SAMSUNG	FBGA	23+	1732	View
DX21TFCK02	SAMSUNG	BGA	23+	1732	View
S5L9294X02-QO	SAMSUNG	TSOP	23+	1732	View
S5L9290X02-E080	SAMSUNG	TSOP-54	23+	1732	View
S3C2510A01	SAMSUNG	TSSOP-54	23+	1732	View
S3P8528BXZZ-C0CB	SAMSUNG	BGA	23+	1732	View
S3P821AXZZ-TWRA	SAMSUNG	BGA	23+	1732	View
S3C49F8A01-KT78	SAMSUNG	FBGA	23+	1732	View
S3C2410AL-20	SAMSUNG	TSOP	23+	1732	View
S1A0241A01-IOBO	SAMSUNG	FBGA178	23+	1732	View
CL10B105K08NNNC	SAMSUNG	BGA	23+	1732	View
CL03C100JA3GNNC	SAMSUNG	TSOP	23+	1732	View
CL05A474KP5NNNC	SAMSUNG	BGA	23+	1732	View

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