SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
SGP3D01-LF	SAMSUNG	96FBGA	23+	1776	View
AA26256-15	SAMSUNG	BGA	23+	1776	View
SFHG42PS101 1842.5MHZ	SAMSUNG	TSOP	23+	1776	View
CS1608X5R105K160NR	SAMSUNG	TSOP	23+	1776	View
S5H1411X01-TO	SAMSUNG	FBGA	23+	1776	View
S5N8947X01-E0RA	SAMSUNG	FBGA	23+	1776	View
S3C3410X01-QA80	SAMSUNG	BGA	23+	1776	View
S3C2410AL-20N	SAMSUNG	BGA	23+	1776	View
S3F94A5XZZ-QZ85	SAMSUNG	BGA	23+	1776	View
S3C9428X35-SO78	SAMSUNG	FBGA	23+	1776	View
S3C44B0X01L-ED80	SAMSUNG	BGA	23+	1776	View
CIB21P110NE	SAMSUNG	TSOP	23+	1776	View
S1C7309X01-E0R0	SAMSUNG	FBGA	23+	1776	View
CL21A335KPFNNNE	SAMSUNG	BGA	23+	1776	View
CL10B821KB8NNNC	SAMSUNG	BGA	23+	1776	View
CL10B223KA8NNNC	SAMSUNG	BGA	23+	1776	View
CL05F104ZO5NNNC	SAMSUNG	BGA	23+	1776	View
CL31F106ZONE	SAMSUNG	TSOP	23+	1776	View
CL10B332KB85PNC	SAMSUNG	BGA	23+	1776	View
CL05CR75CB5NNNC	SAMSUNG	NA	23+	1776	View