SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3F9454BZZ-DR94	SAMSUNG	BGA	23+	1792	View
S3P8469XZZ-QTR9	SAMSUNG	BGA52	23+	1792	View
S3P70F4XZZ-C0C4-3PXRZB	SAMSUNG	BGA	23+	1792	View
S3F9454XZZ-SKB4	SAMSUNG	TSSOP	23+	1792	View
S3C2440AL-40	SAMSUNG	BGA	23+	1792	View
RC1005F104CS	SAMSUNG	TSOP-66	23+	1792	View
S1L9227X01-E080	SAMSUNG	TSOP-66	23+	1792	View
CL32A107MPVNNN	SAMSUNG	FBGA	23+	1792	View
CL21B475KOFNNNE	SAMSUNG	BGA	23+	1792	View
CL05B682KB5NNNC	SAMSUNG	FBGA	23+	1792	View
CL32X107MQVNNWE	SAMSUNG	BGA	23+	1792	View
CL10C220JB8NNNC	SAMSUNG	BGA	23+	1792	View
CL10B104KO85PNC	SAMSUNG	BGA	23+	1792	View
CL10C221JB8NFNC	SAMSUNG	BGA	23+	1792	View
CIH10TR22JNC	SAMSUNG	TSSOP	23+	1792	View
0603C330PF	SAMSUNG	BGA	23+	1792	View
LCX22B2450W1	SAMSUNG	BGA	23+	1788	View
ICPADM200LR	SAMSUNG	BGA	23+	1784	View
DFD0836G0881F	SAMSUNG	BGA60	23+	1780	View
3P80F9XZZ-QZ89	SAMSUNG	FBGA	23+	1776	View

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