SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S6A2067X01-COCX	SAMSUNG	FBGA	23+	1832	View
S6B0741X01-19XN	SAMSUNG	FBGA96	23+	1832	View
S5C7333A01-TO	SAMSUNG	BGA	23+	1832	View
SFH881YF401	SAMSUNG	BGA	23+	1828	View
SFDG75AQ101	SAMSUNG	BGA84	23+	1824	View
SFDG42LH001	SAMSUNG	TSOP54	23+	1820	View
SIT3361D01-DO	SAMSUNG	TSOP54	23+	1816	View
BTBZ0502SA	SAMSUNG	BGA	23+	1816	View
SPHWWTHDD805WHW0DD	SAMSUNG	TSOP	23+	1816	View
S2MPU11X01-6030/S5471	SAMSUNG	BGA	23+	1816	View
ICVE31186E070R100FR	SAMSUNG	SOJ	23+	1816	View
S5K3H1GX33-FGX2	SAMSUNG	BGA	23+	1816	View
S5PV210AA0-LA40	SAMSUNG	TSOP	23+	1816	View
S3C70F4XN3-AV94	SAMSUNG	NA	23+	1816	View
S3C2451X40-YY40	SAMSUNG	BGA	23+	1816	View
S3P84E9XZZ-QZR9	SAMSUNG	BGA	23+	1816	View
S3P9414XZZ-AMB4	SAMSUNG	FBGA	23+	1816	View
CIL31Y100KNE	SAMSUNG	NA	23+	1816	View
S1A0426C02-SO	SAMSUNG	BGA	23+	1816	View
CL21C270JBANNNC	SAMSUNG	FBGA	23+	1816	View