SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3P8475XZZ-AQB5	SAMSUNG	BGA	23+	1836	View
S3C863AX11-AQB9	SAMSUNG	FBGA	23+	1836	View
S3C4510-QERO	SAMSUNG	TSOP54	23+	1836	View
S3C2451XH-40	SAMSUNG	TSSOP56	23+	1836	View
S3F9454XZZ-DHB4	SAMSUNG	BGA	23+	1836	View
RC2012J753CS 75K-0805 5%	SAMSUNG	TSSOP	23+	1836	View
S1D2504A01-D0B0	SAMSUNG	TSOP-44	23+	1836	View
CL10B104KA8NFNC	SAMSUNG	TSOP	23+	1836	View
CL10B103KB85PNC	SAMSUNG	TSOP	23+	1836	View
CL10C101JC8NNNC	SAMSUNG	TSOP-32	23+	1836	View
CLL6A435MR4NLNC	SAMSUNG	FBGA	23+	1836	View
CL02A104MQ2NNNE	SAMSUNG	TSOP	23+	1836	View
CL10A106MQ8NNNC 0603 106M 6.3V	SAMSUNG	TSOP44	23+	1836	View
CL10A106KP8NNNC	SAMSUNG	84FBGA	23+	1836	View
CIH05T3N3SNC	SAMSUNG	BGA	23+	1836	View
0805B102K500CT	SAMSUNG	FBGA	23+	1836	View
SFRG42BC308	SAMSUNG	FBGA	23+	1832	View
SFW942PY002	SAMSUNG	FBGA	23+	1832	View
26MHZ.20PPM	SAMSUNG	BGA	23+	1832	View
SPMWHT223MD5WAP0S0	SAMSUNG	BGA	23+	1832	View

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