SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL21B103KBANFNC	SAMSUNG	BGA	23+	1848	View
CL05A105K05NNNC	SAMSUNG	TSOP50	23+	1848	View
CL10C160JB8NNNC	SAMSUNG	BGA84	23+	1848	View
CL10A474MP6NXNC	SAMSUNG	BGA	23+	1848	View
CL05B272KB5NNNC	SAMSUNG	FBGA	23+	1848	View
CL10B682KB8NNNC	SAMSUNG	FBGA	23+	1848	View
CIG22B4R7MLE	SAMSUNG	BGA	23+	1848	View
CL10B683KB8WPNC	SAMSUNG	SOJ4	23+	1848	View
CL05B104KONC	SAMSUNG	TSOP	23+	1848	View
RC1608F104CS	SAMSUNG	SOP	23+	1848	View
SPMWH1228FD5WARKHJ	SAMSUNG	BGA	23+	1844	View
SFXG50PZ702	SAMSUNG	TSOP54	23+	1840	View
SE14F01-NT	SAMSUNG	NA	23+	1836	View
TMD2201A	SAMSUNG	TSOP32	23+	1836	View
H803A30002	SAMSUNG	TSOP26P	23+	1836	View
F59L1G81A-25TIG	SAMSUNG	TSOP	23+	1836	View
T82C54M-2	SAMSUNG	FBGA	23+	1836	View
SFW881PY002	SAMSUNG	TSOP44	23+	1836	View
S5PV210AH-A0	SAMSUNG	BGA-168	23+	1836	View
S5KA3DFXA5-2T83	SAMSUNG	BGA	23+	1836	View

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