SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL10C560JB8NNWC	SAMSUNG	TSOP	23+	1892	View
CL10B472KB8NNNC	SAMSUNG	TSOP54	23+	1892	View
CL05A225KO5NQNC	SAMSUNG	BGA	23+	1892	View
CL10B122KB8NNNC 0603 122K 50V	SAMSUNG	FBGA	23+	1892	View
CL21B475KAFNFNE	SAMSUNG	TSSOP	23+	1892	View
CL21C331JBANNNC	SAMSUNG	TSOP66	23+	1892	View
CL05B102KB5NNNC	SAMSUNG	TSOP86	23+	1892	View
CIG22B2R2MLE	SAMSUNG	FBGA	23+	1892	View
TCSCS0J106KPAR	SAMSUNG	BGA	23+	1888	View
CY24204ZXC-3T	SAMSUNG	TSOP54	23+	1884	View
ICPADM202CR	SAMSUNG	BGA	23+	1880	View
SMC962-4	SAMSUNG	TSOP	23+	1876	View
SFHG42PS101	SAMSUNG	TSOP	23+	1876	View
S2ABA01X01-6030	SAMSUNG	TSOP54	23+	1876	View
SPMWHT541MD5WATMSD	SAMSUNG	BGA	23+	1876	View
S6B33BFX01-BOCY	SAMSUNG	QFP100	23+	1876	View
S6A0070A01-COCX	SAMSUNG	BGA	23+	1876	View
S5L9275X01	SAMSUNG	SOJ-28	23+	1876	View
DFX0836J0881M	SAMSUNG	TSOP	23+	1872	View
SPMWH1228FD5WATKSA	SAMSUNG	FBGA	23+	1868	View

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