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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
S5K1N1FX13-GGR0 S5K1N1FX13-GGR0 S5K1N1FX13-GGR0 SAMSUNG FBGA 23+ 1752 View
S5M8751X02-J030 S5M8751X02-J030 S5M8751X02-J030 SAMSUNG BGA 23+ 1752 View
S3F84BBXZZ-QW8B S3F84BBXZZ-QW8B S3F84BBXZZ-QW8B SAMSUNG BGA136 23+ 1752 View
S3C2450XH-53 S3C2450XH-53 S3C2450XH-53 SAMSUNG BGA 23+ 1752 View
S3C2451X53-YY40 S3C2451X53-YY40 S3C2451X53-YY40 SAMSUNG BGA 23+ 1752 View
S3C2410A26-Y08N S3C2410A26-Y08N S3C2410A26-Y08N SAMSUNG BGA 23+ 1752 View
CIM10U800NC CIM10U800NC CIM10U800NC SAMSUNG BGA 23+ 1752 View
S1A0903X01-Q080 S1A0903X01-Q080 S1A0903X01-Q080 SAMSUNG FBGA84 23+ 1752 View
CL10C360JB8NNNC CL10C360JB8NNNC CL10C360JB8NNNC SAMSUNG FBGA60 23+ 1752 View
CL21F225ZOFNNNE CL21F225ZOFNNNE CL21F225ZOFNNNE SAMSUNG 178FBGA 23+ 1752 View
CL10B471KB8NNNC CL10B471KB8NNNC CL10B471KB8NNNC SAMSUNG BGA 23+ 1752 View
CL21C100JBANNNC CL21C100JBANNNC CL21C100JBANNNC SAMSUNG TSOP 23+ 1752 View
CL31B102KHFSFNE CL31B102KHFSFNE CL31B102KHFSFNE SAMSUNG BGA 23+ 1752 View
CL10B472KC85PNC CL10B472KC85PNC CL10B472KC85PNC SAMSUNG TSSOP 23+ 1752 View
CIH10TR15JNC CIH10TR15JNC CIH10TR15JNC SAMSUNG BGA200 23+ 1752 View
CIGT252010LMR68MNE CIGT252010LMR68MNE CIGT252010LMR68MNE SAMSUNG TSOP-54 23+ 1752 View
SC32442A31-7080 SC32442A31-7080 SC32442A31-7080 SAMSUNG BGA 23+ 1748 View
BC850-BTF BC850-BTF BC850-BTF SAMSUNG BGA 23+ 1748 View
SPMWHD32AMDPVAUSSK SPMWHD32AMDPVAUSSK SPMWHD32AMDPVAUSSK SAMSUNG TSOP66 23+ 1748 View
HV9963NG-G HV9963NG-G HV9963NG-G SAMSUNG BGA 23+ 1748 View