En
search
ACE
SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
IFR25P0T0SE21 IFR25P0T0SE21 IFR25P0T0SE21 SAMSUNG BGA 23+ 1792 View
SFHG60TQ302 SFHG60TQ302 SFHG60TQ302 SAMSUNG BGA 23+ 1792 View
S5L5009A01-E080 S5L5009A01-E080 S5L5009A01-E080 SAMSUNG FBGA-84 23+ 1792 View
S524C20D21 S524C20D21 S524C20D21 SAMSUNG BGA 23+ 1792 View
S3F9454BZZ-DR94 S3F9454BZZ-DR94 S3F9454BZZ-DR94 SAMSUNG BGA 23+ 1792 View
S3P8469XZZ-QTR9 S3P8469XZZ-QTR9 S3P8469XZZ-QTR9 SAMSUNG BGA52 23+ 1792 View
S3P70F4XZZ-C0C4-3PXRZB S3P70F4XZZ-C0C4-3PXRZB S3P70F4XZZ-C0C4-3PXRZB SAMSUNG BGA 23+ 1792 View
S3F9454XZZ-SKB4 S3F9454XZZ-SKB4 S3F9454XZZ-SKB4 SAMSUNG TSSOP 23+ 1792 View
S3C2440AL-40 S3C2440AL-40 S3C2440AL-40 SAMSUNG BGA 23+ 1792 View
RC1005F104CS RC1005F104CS RC1005F104CS SAMSUNG TSOP-66 23+ 1792 View
S1L9227X01-E080 S1L9227X01-E080 S1L9227X01-E080 SAMSUNG TSOP-66 23+ 1792 View
CL32A107MPVNNN CL32A107MPVNNN CL32A107MPVNNN SAMSUNG FBGA 23+ 1792 View
CL21B475KOFNNNE CL21B475KOFNNNE CL21B475KOFNNNE SAMSUNG BGA 23+ 1792 View
CL05B682KB5NNNC CL05B682KB5NNNC CL05B682KB5NNNC SAMSUNG FBGA 23+ 1792 View
CL32X107MQVNNWE CL32X107MQVNNWE CL32X107MQVNNWE SAMSUNG BGA 23+ 1792 View
CL10C220JB8NNNC CL10C220JB8NNNC CL10C220JB8NNNC SAMSUNG BGA 23+ 1792 View
CL10B104KO85PNC CL10B104KO85PNC CL10B104KO85PNC SAMSUNG BGA 23+ 1792 View
CL10C221JB8NFNC CL10C221JB8NFNC CL10C221JB8NFNC SAMSUNG BGA 23+ 1792 View
CIH10TR22JNC CIH10TR22JNC CIH10TR22JNC SAMSUNG TSSOP 23+ 1792 View
0603C330PF 0603C330PF 0603C330PF SAMSUNG BGA 23+ 1792 View