SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3P9414XZZ-AMB4	SAMSUNG	FBGA	23+	1816	View
CIL31Y100KNE	SAMSUNG	NA	23+	1816	View
S1A0426C02-SO	SAMSUNG	BGA	23+	1816	View
CL21C270JBANNNC	SAMSUNG	FBGA	23+	1816	View
CL03A104KA3NNNC	SAMSUNG	BGA	23+	1816	View
CL21A106KAYNNNE	SAMSUNG	TSOP	23+	1816	View
CL21B104MOCNBNC	SAMSUNG	BGA	23+	1816	View
CL10B104KA8NNNC	SAMSUNG	BGA170	23+	1816	View
CL21A106MPFNNNE	SAMSUNG	TSOP	23+	1816	View
CL05A475MQ5NRNC	SAMSUNG	TSOP	23+	1816	View
CIGT201610LHR47MNE	SAMSUNG	BGA84	23+	1816	View
EM1C31B104SANC	SAMSUNG	TSOP32	23+	1812	View
TCSCS0J226MAAR	SAMSUNG	FBGA	23+	1808	View
AKM628128BLP-7	SAMSUNG	BGA	23+	1804	View
HY57V641620ETP	SAMSUNG	BGA	23+	1804	View
SPS-HI15	SAMSUNG	FBGA84	23+	1804	View
SMJ320C25-50GBM	SAMSUNG	BGA	23+	1804	View
TCSCN0J225MAAR(6.3WV/2.2UF)	SAMSUNG	BGA	23+	1804	View
S5L9226X01	SAMSUNG	BGA	23+	1804	View
S5D2650X01-Q080	SAMSUNG	BGA	23+	1804	View