SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL05F104ZO5NNNC	SAMSUNG	BGA	23+	1776	View
CL31F106ZONE	SAMSUNG	TSOP	23+	1776	View
CL10B332KB85PNC	SAMSUNG	BGA	23+	1776	View
CL05CR75CB5NNNC	SAMSUNG	NA	23+	1776	View
CIH05T33NJNC	SAMSUNG	TSOP	23+	1776	View
3F84U8XZZ-QZ88	SAMSUNG	FBGA	23+	1776	View
C0603C512F5GAC	SAMSUNG	TSOP54	23+	1772	View
EMIL21C220MANE	SAMSUNG	BGA	23+	1768	View
HE82AE1U12	SAMSUNG	NA	23+	1768	View
SPMWHT325AD5YBRPSC	SAMSUNG	TSOP54	23+	1768	View
S6B0107B01-COCX	SAMSUNG	BGA	23+	1768	View
S3F84BBXZZ-TWRB	SAMSUNG	BGA	23+	1768	View
TCC112-G	SAMSUNG	BGA	23+	1764	View
IFR25P0T0SE22	SAMSUNG	TSOP66	23+	1760	View
SE516M-LF	SAMSUNG	BGA	23+	1756	View
SWL-2700S	SAMSUNG	BGA	23+	1752	View
SE717M-LF	SAMSUNG	TSOP-50	23+	1752	View
SE517M-LF	SAMSUNG	BGA	23+	1752	View
EFMTIM5B	SAMSUNG	BGA	23+	1752	View
SQ2O03840KEINC	SAMSUNG	BGA	23+	1752	View