SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S1A0241A01-IOBO	SAMSUNG	FBGA178	23+	1732	View
CL10B105K08NNNC	SAMSUNG	BGA	23+	1732	View
CL03C100JA3GNNC	SAMSUNG	TSOP	23+	1732	View
CL05A474KP5NNNC	SAMSUNG	BGA	23+	1732	View
CL21Y106KPQVPNE	SAMSUNG	FBGA	23+	1732	View
CL05C121JB5NNNC	SAMSUNG	FBGA-136	23+	1732	View
CL21C331JCANNNC	SAMSUNG	BGA	23+	1732	View
CL05B222KB5VPNC	SAMSUNG	BGA	23+	1732	View
CIG10W2R2MNC	SAMSUNG	TSOP	23+	1732	View
DX21TFAG02	SAMSUNG	TSOP66	23+	1728	View
CL31F225ZAFNNNE	SAMSUNG	TSOP54	23+	1728	View
SMP6773GB3500	SAMSUNG	TSOP	23+	1728	View
SPSWH4S42S1G70R1M3	SAMSUNG	FBGA	23+	1724	View
HED55XXU11	SAMSUNG	BGA	23+	1720	View
EMIL21C180SANE	SAMSUNG	FBGA	23+	1716	View
60CMERCURYR	SAMSUNG	BGA	23+	1716	View
IRFU310TU	SAMSUNG	BGA	23+	1716	View
SPMWHT541MD5WAT0S2	SAMSUNG	BGA	23+	1716	View
S6D0128X01-B0C8	SAMSUNG	TSOP-66	23+	1716	View
S6A0069X01-C0CX	SAMSUNG	TSOP	23+	1716	View