SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S5H1409X01-T0	SAMSUNG	TSOP54	23+	1716	View
SSR3055TM	SAMSUNG	BGAZ	23+	1712	View
SFHG89DA002	SAMSUNG	BGA90	23+	1708	View
S4LN045X01-8030	SAMSUNG	TSOP	23+	1704	View
R801716VTC-TI07	SAMSUNG	TSSOP	23+	1700	View
SFHG42MQ101	SAMSUNG	BGA	23+	1700	View
TCSCS1D336MCAR	SAMSUNG	BGA44	23+	1700	View
SC5C111AAX-A040	SAMSUNG	BGA	23+	1700	View
VMTICS02580675518	SAMSUNG	BGA	23+	1700	View
S5L9294X02-Q080	SAMSUNG	BGA	23+	1700	View
S5L9278X01-T080	SAMSUNG	BGA	23+	1700	View
S3C2416XH-40	SAMSUNG	FBGA	23+	1700	View
S3P22BAZZ-QZ88	SAMSUNG	BGA	23+	1700	View
S3C9428X16-COC4	SAMSUNG	FBGA	23+	1700	View
S3C2510A01L	SAMSUNG	NA	23+	1700	View
CIL10NR10KNE	SAMSUNG	FBGA	23+	1700	View
S1L9223B01-00	SAMSUNG	BGA	23+	1700	View
CL10B333KBNC	SAMSUNG	BGA	23+	1700	View
CL32B106KOULNNE	SAMSUNG	BGA	23+	1700	View
CL03C180JA3NNNC	SAMSUNG	TSSOP	23+	1700	View