En
search
ACE
SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
S3C80F9BDV-C0C7 S3C80F9BDV-C0C7 S3C80F9BDV-C0C7 SAMSUNG PBGA48 23+ 2136 View
S3F84ZBXZZ-QX8B S3F84ZBXZZ-QX8B S3F84ZBXZZ-QX8B SAMSUNG BGA48 23+ 2136 View
S3C8249X58-TWR7 S3C8249X58-TWR7 S3C8249X58-TWR7 SAMSUNG SOP 23+ 2136 View
S3C44B0X01L S3C44B0X01L S3C44B0X01L SAMSUNG SOP 23+ 2136 View
RC1005J103CS RC1005J103CS RC1005J103CS SAMSUNG SOP 23+ 2136 View
CL21B473KBCNNNC CL21B473KBCNNNC CL21B473KBCNNNC SAMSUNG DIP 23+ 2136 View
CL10C121JB8NNWC CL10C121JB8NNWC CL10C121JB8NNWC SAMSUNG SOP 23+ 2136 View
CL32A226KAJNNNE CL32A226KAJNNNE CL32A226KAJNNNE SAMSUNG TSSOP44 23+ 2136 View
CL05B103KB5NNPC CL05B103KB5NNPC CL05B103KB5NNPC SAMSUNG TSOP-44 23+ 2136 View
CL05A224MQLHECE CL05A224MQLHECE CL05A224MQLHECE SAMSUNG TSOP32 23+ 2136 View
CL05B154KO5NNNC CL05B154KO5NNNC CL05B154KO5NNNC SAMSUNG SOP-32 23+ 2136 View
CL10B473KC8WPNC CL10B473KC8WPNC CL10B473KC8WPNC SAMSUNG DIP32 23+ 2136 View
CIG22W3R3MNE CIG22W3R3MNE CIG22W3R3MNE SAMSUNG SOP 23+ 2136 View
SFHG60MQ102 SFHG60MQ102 SFHG60MQ102 SAMSUNG TSSOP 23+ 2132 View
SFHG56JA002 SFHG56JA002 SFHG56JA002 SAMSUNG TSOP 23+ 2128 View
SE1179LMRL SE1179LMRL SE1179LMRL SAMSUNG SOP32 23+ 2124 View
M393A2K43DB3-CWE M393A2K43DB3-CWE M393A2K43DB3-CWE SAMSUNG TSOP 23+ 2124 View
SIA2206E02-HO SIA2206E02-HO SIA2206E02-HO SAMSUNG SOP-32 23+ 2124 View
LPUC041T0B-B3 LPUC041T0B-B3 LPUC041T0B-B3 SAMSUNG TSOP 23+ 2124 View
SWL-W11CL SWL-W11CL SWL-W11CL SAMSUNG SOP32 23+ 2124 View