SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
ML61-00168S	SAMSUNG	TSOP	23+	2124	View
S5N8946X01-Q0RM	SAMSUNG	32TSOP	23+	2124	View
S5L8030X01-T080	SAMSUNG	TSOP32	23+	2124	View
S3C70F4XK9-AVB4	SAMSUNG	TSOP32	23+	2124	View
S3P70F4XZZ-AV94	SAMSUNG	TSOP	23+	2124	View
S3C4500X01	SAMSUNG	DIP32	23+	2124	View
S3C72N4X61-COC4	SAMSUNG	SOP32	23+	2124	View
S3P9658AZZ-SH98	SAMSUNG	SOP	23+	2124	View
RC2012J301CS 300R-0805 5%	SAMSUNG	TSOP	23+	2124	View
S1T3361D01	SAMSUNG	TSOP	23+	2124	View
CL31C680JBCNNNC	SAMSUNG	SOP32	23+	2124	View
CL10A106KB8NNNC	SAMSUNG	SOP32	23+	2124	View
CL10B682JB8NNNC	SAMSUNG	TSOP	23+	2124	View
CL32B475KBJNNNE	SAMSUNG	SOP28	23+	2124	View
CL02C300J02ANNE	SAMSUNG	DIP	23+	2124	View
CL21C470JBANNNC	SAMSUNG	TSOP32	23+	2124	View
CL21C120JBANNNC	SAMSUNG	TSOP	23+	2124	View
CIH10T18NJNC	SAMSUNG	TSOP	23+	2124	View
0805-25V106-K	SAMSUNG	TSSOP	23+	2124	View
TMD2201ALF	SAMSUNG	TSOP-44	23+	2120	View