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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
ML61-00168S ML61-00168S ML61-00168S SAMSUNG TSOP 23+ 2124 View
S5N8946X01-Q0RM S5N8946X01-Q0RM S5N8946X01-Q0RM SAMSUNG 32TSOP 23+ 2124 View
S5L8030X01-T080 S5L8030X01-T080 S5L8030X01-T080 SAMSUNG TSOP32 23+ 2124 View
S3C70F4XK9-AVB4 S3C70F4XK9-AVB4 S3C70F4XK9-AVB4 SAMSUNG TSOP32 23+ 2124 View
S3P70F4XZZ-AV94 S3P70F4XZZ-AV94 S3P70F4XZZ-AV94 SAMSUNG TSOP 23+ 2124 View
S3C4500X01 S3C4500X01 S3C4500X01 SAMSUNG DIP32 23+ 2124 View
S3C72N4X61-COC4 S3C72N4X61-COC4 S3C72N4X61-COC4 SAMSUNG SOP32 23+ 2124 View
S3P9658AZZ-SH98 S3P9658AZZ-SH98 S3P9658AZZ-SH98 SAMSUNG SOP 23+ 2124 View
RC2012J301CS 300R-0805 5% RC2012J301CS 300R-0805 5% RC2012J301CS 300R-0805 5% SAMSUNG TSOP 23+ 2124 View
S1T3361D01 S1T3361D01 S1T3361D01 SAMSUNG TSOP 23+ 2124 View
CL31C680JBCNNNC CL31C680JBCNNNC CL31C680JBCNNNC SAMSUNG SOP32 23+ 2124 View
CL10A106KB8NNNC CL10A106KB8NNNC CL10A106KB8NNNC SAMSUNG SOP32 23+ 2124 View
CL10B682JB8NNNC CL10B682JB8NNNC CL10B682JB8NNNC SAMSUNG TSOP 23+ 2124 View
CL32B475KBJNNNE CL32B475KBJNNNE CL32B475KBJNNNE SAMSUNG SOP28 23+ 2124 View
CL02C300J02ANNE CL02C300J02ANNE CL02C300J02ANNE SAMSUNG DIP 23+ 2124 View
CL21C470JBANNNC CL21C470JBANNNC CL21C470JBANNNC SAMSUNG TSOP32 23+ 2124 View
CL21C120JBANNNC CL21C120JBANNNC CL21C120JBANNNC SAMSUNG TSOP 23+ 2124 View
CIH10T18NJNC CIH10T18NJNC CIH10T18NJNC SAMSUNG TSOP 23+ 2124 View
0805-25V106-K 0805-25V106-K 0805-25V106-K SAMSUNG TSSOP 23+ 2124 View
TMD2201ALF TMD2201ALF TMD2201ALF SAMSUNG TSOP-44 23+ 2120 View