SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CIL21N68NMNE	SAMSUNG	TSOP	23+	2148	View
S1L9226X01	SAMSUNG	BGA	23+	2148	View
CL31F105ZBFNNNE	SAMSUNG	FBGA	23+	2148	View
CL31B224MBNE	SAMSUNG	FBGA	23+	2148	View
CL10B225KP8NNNC	SAMSUNG	BGA	23+	2148	View
CL05X105KQ5NNNC	SAMSUNG	BGA48	23+	2148	View
CL02C010BO2GNNC	SAMSUNG	BGA	23+	2148	View
CL21B104KCCWPNC	SAMSUNG	BGA	23+	2148	View
CL05B103KB5NNNC	SAMSUNG	BGA	23+	2148	View
CIGT252010LM2R2MNE	SAMSUNG	TSSOP	23+	2148	View
TCSCS1C475KAAR	SAMSUNG	FBGA	23+	2144	View
TEGPSP20J106M8RF	SAMSUNG	BGA48	23+	2140	View
CY62128-55ZC	SAMSUNG	PBGA48	23+	2136	View
3C1840D78SMB1	SAMSUNG	BGA	23+	2136	View
IFF0455G6SE02	SAMSUNG	PBGA48	23+	2136	View
SLHNNWW511N1S0U0F3	SAMSUNG	BGA	23+	2136	View
S2ABB01X01-6530	SAMSUNG	BGA	23+	2136	View
S5L5005X01-E080	SAMSUNG	BGA	23+	2136	View
S5M8767A01-6030-63MQAV	SAMSUNG	TSOP	23+	2136	View
S3C2410X01-Y0R0	SAMSUNG	BGA	23+	2136	View

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