SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S1M8690X01-J070	SAMSUNG	QFP	23+	2180	View
CL10C121KB8NNNC	SAMSUNG	BGA	23+	2180	View
CL31A226KPHNNNE	SAMSUNG	BGA	23+	2180	View
CL05A105KA5NQPC	SAMSUNG	BGA	23+	2180	View
CL21A476MRYNNNE	SAMSUNG	QFP	23+	2180	View
CLR1COR6BA1NNNE	SAMSUNG	BGA	23+	2180	View
CL21C151JCANNNC	SAMSUNG	BGA	23+	2180	View
CL03C101JA3ANNC	SAMSUNG	BGA	23+	2180	View
CIG22H1R0MAE	SAMSUNG	QFP	23+	2180	View
SLSNNBL103TS ZTF N707	SAMSUNG	BGA	23+	2176	View
SE1319L-RT	SAMSUNG	BGA	23+	2176	View
S3C44BOX01-YD80	SAMSUNG	QFP	23+	2176	View
CIB31P700NE	SAMSUNG	QFP	23+	2176	View
CL10B334KP8NNNC	SAMSUNG	BGA	23+	2176	View
CIH05T47NJNC	SAMSUNG	QFP	23+	2176	View
DFX0836H0881A	SAMSUNG	BGA	23+	2172	View
1608HT68NH	SAMSUNG	BGA	23+	2168	View
1608CH1NF	SAMSUNG	BGA	23+	2164	View
ICVE21184E150R101	SAMSUNG	BGA	23+	2164	View
SLTNWW2502AN	SAMSUNG	BGA	23+	2164	View

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