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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
S5L840FX01-TO S5L840FX01-TO S5L840FX01-TO SAMSUNG TQFP100 23+ 2200 View
S5L8030X05-T081 S5L8030X05-T081 S5L8030X05-T081 SAMSUNG BGA 23+ 2200 View
S3P9228AZZ-AQB8 S3P9228AZZ-AQB8 S3P9228AZZ-AQB8 SAMSUNG BGA 23+ 2200 View
S3C6400XL-53 S3C6400XL-53 S3C6400XL-53 SAMSUNG FBGA/165 23+ 2200 View
S3P7335XZZ-QW85 S3P7335XZZ-QW85 S3P7335XZZ-QW85 SAMSUNG BGA 23+ 2200 View
S3C7565X47-C0C5 S3C7565X47-C0C5 S3C7565X47-C0C5 SAMSUNG BGA 23+ 2200 View
S3C2410AL-26N S3C2410AL-26N S3C2410AL-26N SAMSUNG BGA165 23+ 2200 View
CIM05J600NC CIM05J600NC CIM05J600NC SAMSUNG QFP 23+ 2200 View
S1T3361D01-D0 S1T3361D01-D0 S1T3361D01-D0 SAMSUNG TQFP100 23+ 2200 View
CL31A226MPHNNNE CL31A226MPHNNNE CL31A226MPHNNNE SAMSUNG TQFP 23+ 2200 View
CL10C300JBNC CL10C300JBNC CL10C300JBNC SAMSUNG QFP 23+ 2200 View
CL21B393KBANNNC CL21B393KBANNNC CL21B393KBANNNC SAMSUNG BGA 23+ 2200 View
CL05B102JB5NNNC CL05B102JB5NNNC CL05B102JB5NNNC SAMSUNG BGA 23+ 2200 View
CL10C6R2DB8NNNC CL10C6R2DB8NNNC CL10C6R2DB8NNNC SAMSUNG TQFP 23+ 2200 View
CL21C101JC61PNC CL21C101JC61PNC CL21C101JC61PNC SAMSUNG QFP 23+ 2200 View
CL10B183KB8NNNC CL10B183KB8NNNC CL10B183KB8NNNC SAMSUNG QFP 23+ 2200 View
CIH2012TR10JNE CIH2012TR10JNE CIH2012TR10JNE SAMSUNG BGA 23+ 2200 View
3F9488XZZ-QZR8 3F9488XZZ-QZR8 3F9488XZZ-QZR8 SAMSUNG BGA 23+ 2200 View
LCB10B2450K3 LCB10B2450K3 LCB10B2450K3 SAMSUNG TQFP 23+ 2196 View
TCPCS0J157MBAR0070 TCPCS0J157MBAR0070 TCPCS0J157MBAR0070 SAMSUNG FBGA165 23+ 2196 View