SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S5L1464X01-EO	SAMSUNG	BGA	23+	2236	View
S5H1409X01-T080	SAMSUNG	FBGA153	23+	2236	View
S3C2440AL-30	SAMSUNG	BGA130	23+	2236	View
S3FS9CIX	SAMSUNG	BGA	23+	2236	View
S3C2416XH-53	SAMSUNG	BGA	23+	2236	View
S3C44B0X01-YD80	SAMSUNG	BGA	23+	2236	View
S3C4510B01-QE80	SAMSUNG	BGA	23+	2236	View
RC1005F122CS	SAMSUNG	BGA	23+	2236	View
S1A0903X01-E080	SAMSUNG	BGA107	23+	2236	View
CL21A475KBQNNNE	SAMSUNG	BGA	23+	2236	View
CL21B222KCANNNC	SAMSUNG	BGA	23+	2236	View
CL03C560JA3ANNC	SAMSUNG	FBGA153	23+	2236	View
CL31B472KHFNFNE	SAMSUNG	BGA	23+	2236	View
CL31B472KGFNNNE	SAMSUNG	BGA	23+	2236	View
CL05C2R2CB5NNNC	SAMSUNG	BGA	23+	2236	View
CL10C151JB81PNC	SAMSUNG	BGA	23+	2236	View
CIGW252010GLR47MNE	SAMSUNG	BGA56	23+	2236	View
0402 105K 10V/X5R	SAMSUNG	BGA	23+	2236	View
TCSCS1E335MBAR	SAMSUNG	BGA	23+	2232	View
CL10A106KP8NNNC	SAMSUNG	BGA130	23+	2232	View

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