SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
TCSCS1A685MAAR	SAMSUNG	FBGA	23+	2228	View
LC4128ZE-7TN144C(SVG1)	SAMSUNG	FBGA	23+	2224	View
SEMP690-LF	SAMSUNG	BGA130	23+	2224	View
C6262LKA01	SAMSUNG	BGA	23+	2224	View
SWL-2560S	SAMSUNG	BGA	23+	2224	View
TCSCN1V224MAAR	SAMSUNG	BGA130	23+	2224	View
S5L9286F01-QO	SAMSUNG	BGA	23+	2224	View
S5D0125X01-Q0R0	SAMSUNG	BGA120	23+	2224	View
S3F8S5AXZZ-QZ8A	SAMSUNG	FBGA/165	23+	2224	View
S3C2412XL-26 BGA	SAMSUNG	FBGA/165	23+	2224	View
S3C4530A01-QER0	SAMSUNG	BGA	23+	2224	View
S3C863AXL0-AQ9A	SAMSUNG	BGA	23+	2224	View
S3P7048DZZ-QZ88	SAMSUNG	TQFP/100	23+	2224	View
CIC21P300NE	SAMSUNG	QFP100	23+	2224	View
S1T8603X01-DO	SAMSUNG	BGA	23+	2224	View
CL10A475KO8NNNC	SAMSUNG	BGA	23+	2224	View
CL10B474KB8NNNC	SAMSUNG	BGA	23+	2224	View
CL31F475ZONE	SAMSUNG	FBGA/165	23+	2224	View
CL10B105KO8NNNL	SAMSUNG	QFP	23+	2224	View
CL05B563KO5NNNC	SAMSUNG	BGA	23+	2224	View

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