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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
CL21A106MBFNNNE CL21A106MBFNNNE CL21A106MBFNNNE SAMSUNG SOP-24 23+ 2443 View
HE12AFU11 HE12AFU11 HE12AFU11 SAMSUNG SOP-24 23+ 2440 View
SPMWHD32AMD7XAR3S0 SPMWHD32AMD7XAR3S0 SPMWHD32AMD7XAR3S0 SAMSUNG SOP 23+ 2440 View
HE12AE1U11 HE12AE1U11 HE12AE1U11 SAMSUNG TSSOP 23+ 2440 View
SPMWHT541ML5XAPKS6 SPMWHT541ML5XAPKS6 SPMWHT541ML5XAPKS6 SAMSUNG BGA 23+ 2440 View
S6SY661X03-Y030 S6SY661X03-Y030 S6SY661X03-Y030 SAMSUNG BGA 23+ 2440 View
S6D0171X01-B4D8 S6D0171X01-B4D8 S6D0171X01-B4D8 SAMSUNG GBA 23+ 2440 View
S5PC100A66-LA40 S5PC100A66-LA40 S5PC100A66-LA40 SAMSUNG SSOP 23+ 2440 View
HE12AE1D12L HE12AE1D12L HE12AE1D12L SAMSUNG SOT-23 23+ 2436 View
FEM8255TBA FEM8255TBA FEM8255TBA SAMSUNG SOT-23 23+ 2432 View
SENK13-CB SENK13-CB SENK13-CB SAMSUNG TSOP48 23+ 2432 View
S3P7048DZZ-C0C8 S3P7048DZZ-C0C8 S3P7048DZZ-C0C8 SAMSUNG TSOP-48 23+ 2432 View
CL05C3R9CBNC CL05C3R9CBNC CL05C3R9CBNC SAMSUNG TSOP 23+ 2432 View
CIG22H1R2MNE CIG22H1R2MNE CIG22H1R2MNE SAMSUNG BGA 23+ 2432 View
DX21TFAP03 DX21TFAP03 DX21TFAP03 SAMSUNG BGA 23+ 2428 View
CMC6230F CMC6230F CMC6230F SAMSUNG TSOP48 23+ 2424 View
SE7889-LF QFP SE7889-LF QFP SE7889-LF QFP SAMSUNG BGA 23+ 2424 View
MT29F32G08FAAWP:A MT29F32G08FAAWP:A MT29F32G08FAAWP:A SAMSUNG BGA 23+ 2424 View
SFX836KN001 SFX836KN001 SFX836KN001 SAMSUNG TSOP48 23+ 2424 View
DX121-C6AHA24DF-LDT DX121-C6AHA24DF-LDT DX121-C6AHA24DF-LDT SAMSUNG BGA 23+ 2424 View