SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL32B106KBJNNWE	SAMSUNG	QFP100	23+	2468	View
CL21B104JBCNNNC	SAMSUNG	SOP28	23+	2468	View
CL05B104KO5NNNC	SAMSUNG	TSOP	23+	2468	View
CIGT252010EH2R2SEN	SAMSUNG	TSOP48	23+	2468	View
S4L85J2X01	SAMSUNG	BGA153	23+	2464	View
S3F8S28X	SAMSUNG	FBGA	23+	2464	View
CIL21J1R8KNE	SAMSUNG	QFP	23+	2464	View
CL10C3R9CB8NNNC	SAMSUNG	50TSOP	23+	2464	View
CL05F224ZP5NNNC	SAMSUNG	TSOP	23+	2464	View
CL10B104KC8NNWC	SAMSUNG	TSOP	23+	2464	View
IRFR020TF	SAMSUNG	BGA	23+	2460	View
SE7889-LF	SAMSUNG	SOP-36P	23+	2456	View
88F6290-B0-BHW2C800	SAMSUNG	BGA	23+	2456	View
PP5021C-TDF	SAMSUNG	BGA221	23+	2456	View
SLHNNWW629T1S0T0S0	SAMSUNG	TSOP56	23+	2456	View
IML2811CC-TR	SAMSUNG	QFP	23+	2456	View
S5H2111X01-B080	SAMSUNG	BGA	23+	2456	View
S524A40X21-SC70/S524A40X21	SAMSUNG	BGA	23+	2456	View
S3F9444ZZ	SAMSUNG	TSOP48	23+	2456	View
S3NRN81XC1	SAMSUNG	TSOP48	23+	2456	View

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