SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3F84ZBXZZ-QX8B	SAMSUNG	TSOP48	23+	2456	View
S3F9454BZZ-VK94	SAMSUNG	DIP40	23+	2456	View
S3F80J9SSZ-C0C9	SAMSUNG	DIP	23+	2456	View
S1D2511C01-A0	SAMSUNG	TSOP48	23+	2456	View
CL21F105ZOCNNNC	SAMSUNG	BGA	23+	2456	View
CL10B561KB8NNNC	SAMSUNG	TSOP48	23+	2456	View
CL05C050CB5NNNC	SAMSUNG	SSOP	23+	2456	View
CL05B102KB5NNPC	SAMSUNG	SSOP	23+	2456	View
CL10B221KB8NNNC 0603 220P 50V	SAMSUNG	TSOP54	23+	2456	View
CL05B104KO54PNC	SAMSUNG	TSOP48	23+	2456	View
CL10B333KB8WPNC	SAMSUNG	TSOP24	23+	2456	View
CIG22H1R0MNE	SAMSUNG	FBGA153	23+	2456	View
IFR3386T0SE22	SAMSUNG	BGA	23+	2452	View
ICPZBS243QR	SAMSUNG	SOP-8	23+	2448	View
SPS-HI16	SAMSUNG	BGA	23+	2448	View
SDP1106 ECHO-P	SAMSUNG	TSOP48	23+	2448	View
STP2945 LF	SAMSUNG	BGA	23+	2444	View
M393A2K43CB2-CVF	SAMSUNG	BGA	23+	2444	View
LMSP43QLA003	SAMSUNG	DIP32	23+	2444	View
SFB942BZ001	SAMSUNG	FBGA	23+	2444	View

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