SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
74AC174SC	SAMSUNG	BGA	23+	2508	View
TCSCS0J106MPAR	SAMSUNG	DIP	23+	2504	View
M392B5270CH0-YF8	SAMSUNG	BGA	23+	2500	View
SIL9223B01-QORO	SAMSUNG	FBGA	23+	2500	View
TCSCS1A106MAAR	SAMSUNG	BGA	23+	2500	View
STPCD0175BTI3	SAMSUNG	BGA	23+	2500	View
TCSCS1A685KAAR	SAMSUNG	QFP	23+	2500	View
S5L1455X01-Q0	SAMSUNG	BGA	23+	2500	View
S5E7570XU0-LA30	SAMSUNG	BGA-162	23+	2500	View
S3C2410A26-YO80	SAMSUNG	FBGA153	23+	2500	View
S3C9234X51-QT84	SAMSUNG	BGA	23+	2500	View
S3C7054D28-SOB2	SAMSUNG	FBGA	23+	2500	View
S3F9488XZZ-QZ88	SAMSUNG	FBGA	23+	2500	View
S3F94C4EZZ-SK94	SAMSUNG	SOJ	23+	2500	View
S1D2507B01-AO	SAMSUNG	TSOP48	23+	2500	View
CL21F105ZAFNNNE	SAMSUNG	BGA	23+	2500	View
CL03C220JA3GNNC	SAMSUNG	SOP32	23+	2500	View
CL05A104KA5NNPC	SAMSUNG	SOP32	23+	2500	View
CL10A475KP8NNNL	SAMSUNG	SOP28	23+	2500	View
CL21B223KCFNNNE	SAMSUNG	SOJ	23+	2500	View

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