SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CIS21P300NE	SAMSUNG	BGA	23+	2520	View
S1A2297B01	SAMSUNG	BGA	23+	2520	View
CL21X475KAQNNNE	SAMSUNG	TSOP48	23+	2520	View
CL10C220JB8NNNC	SAMSUNG	SOP28	23+	2520	View
CL21B152KBANNNC	SAMSUNG	SOP	23+	2520	View
CL31A106KAHNNNE	SAMSUNG	BGA	23+	2520	View
CL10B474KO8NFNC	SAMSUNG	TSSOP	23+	2520	View
CL21B474KBF4PNE	SAMSUNG	SOJ24	23+	2520	View
CL10B102KC8WPJC	SAMSUNG	BGA	23+	2520	View
CIH10T56NJNC	SAMSUNG	221-FBGA	23+	2520	View
3F84A5XZZ-SN95	SAMSUNG	TSOP	23+	2520	View
S6B0721X02-B0CY	SAMSUNG	SOJ	23+	2520	View
TCSCS1A106MAAR	SAMSUNG	FBGA	23+	2516	View
TCSCS1C475MAAR	SAMSUNG	BGA	23+	2516	View
SFHG60MQ102	SAMSUNG	BGA	23+	2516	View
SPMWH1228FD5WARKSE	SAMSUNG	FBGA240	23+	2516	View
S6B0107B01-Q0	SAMSUNG	BGA	23+	2516	View
S6B33BGA01-B0FY	SAMSUNG	DIP-16	23+	2516	View
S6B33B0A02-B0CY	SAMSUNG	FBGA	23+	2516	View
BCW61A-MTF	SAMSUNG	CCD-16	23+	2512	View

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