SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL21A106KPFNNNE	SAMSUNG	TSOP-44	23+	2412	View
CL10F223ZB8NNNC	SAMSUNG	BGA	23+	2412	View
CL03A103KQ3NSHC	SAMSUNG	FBGA142	23+	2412	View
CL05C200JB51PNC	SAMSUNG	BGA	23+	2412	View
CIG2MWR47MNE	SAMSUNG	SOIC-20	23+	2412	View
TCSCS0J106MPAS	SAMSUNG	BGA	23+	2408	View
EMIC21F104SANC	SAMSUNG	TSOP48	23+	2408	View
S5L840FX01-TO	SAMSUNG	TSOP48	23+	2408	View
T0805R105KCT	SAMSUNG	TSOP48	23+	2404	View
CL21B153KBANNNC	SAMSUNG	BGA	23+	2401	View
CL31B106KPHNNNE	SAMSUNG	TSOP48	23+	2401	View
SEMS31-C	SAMSUNG	SOP	23+	2400	View
M393B2G70EB0-CMA	SAMSUNG	BGA	23+	2400	View
SDP1106 ECHO-P	SAMSUNG	BGA	23+	2400	View
SE859MH-LF	SAMSUNG	TSOP28	23+	2400	View
SC5C110AAD-A040	SAMSUNG	FBGA	23+	2400	View
SSD2002TF	SAMSUNG	TSOP48	23+	2400	View
S5KA3DFXA5-2T83	SAMSUNG	BGA	23+	2400	View
S5L9288D01-TO	SAMSUNG	TSOP48	23+	2400	View
S3C2410X01	SAMSUNG	DIP	23+	2400	View

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