SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
60CMERCURYR	SAMSUNG	TSOP48	23+	2720	View
S5H1411X01-T0	SAMSUNG	BGA	23+	2720	View
S3F94A5XZZ-AO95	SAMSUNG	SOP	23+	2720	View
CL10C040CBNC	SAMSUNG	BGA	23+	2720	View
CL05A106MP6NUN8	SAMSUNG	BGA	23+	2720	View
SKYLARK-A	SAMSUNG	BGA153	23+	2716	View
D87C51FB	SAMSUNG	TSSOP	23+	2712	View
SSR3055ATM	SAMSUNG	TSOP44	23+	2708	View
SSD2009ATF	SAMSUNG	TSOP	23+	2704	View
S3P8245XZZ-QWR5	SAMSUNG	DIP	23+	2704	View
SEMP690-1	SAMSUNG	TSOP48	23+	2704	View
SEN81DGXS1-YT30	SAMSUNG	TSSOP-48	23+	2700	View
SSD2102ATF	SAMSUNG	SOP32	23+	2696	View
CL31B225KOHNNWE	SAMSUNG	BGA	23+	2695	View
CL31A106MQNE(1206-106M)	SAMSUNG	TSOP48	23+	2695	View
CL21C102JBCNNNC	SAMSUNG	SOP-32P	23+	2695	View
SSD2007ATF MOS	SAMSUNG	BGA	23+	2692	View
SID2552X03-AO	SAMSUNG	BGA	23+	2688	View
CL21A475KOFNNNE	SAMSUNG	DIP-28	23+	2688	View
SQ2D02700D2JCG	SAMSUNG	SOJ-24	23+	2688	View

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