SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
1206 476M 6.3V/X5R	SAMSUNG	TSOP	23+	2828	View
CL10A226MP8NRNC	SAMSUNG	TSOP40	23+	2828	View
1206 226K 25V/X5R	SAMSUNG	BGA	23+	2824	View
1206 226K 16V/X5R	SAMSUNG	BGA	23+	2820	View
1206 106K 50V/X5R	SAMSUNG	BGA	23+	2816	View
1206 106K 25V/X5R	SAMSUNG	DIP-8	23+	2812	View
SIP005AFS30	SAMSUNG	BGA	23+	2808	View
TCSCS1D475MAAR	SAMSUNG	BGA	23+	2804	View
SWL-2480	SAMSUNG	TSOP86	23+	2800	View
CL31E103KINC	SAMSUNG	BGA	23+	2800	View
SEMS01-LF	SAMSUNG	DIP	23+	2800	View
S3C2800X01-EER0	SAMSUNG	TSOP48	23+	2800	View
CIB21P300NE	SAMSUNG	BGA	23+	2800	View
CL21C221JBANNNC	SAMSUNG	TSOP48	23+	2800	View
CL31A475KB9LNNC	SAMSUNG	DIP28	23+	2800	View
S3F80JBBUK-QZ8B	SAMSUNG	TSOP	23+	2800	View
S5H1432X01-JO	SAMSUNG	TSOP48	23+	2800	View
VOF1748C28DKB	SAMSUNG	DIP24	23+	2796	View
CL31A107MQHNNN 1206 107M 6.3V	SAMSUNG	TSOP48	23+	2793	View
62S16256EU-55LL1	SAMSUNG	TSSOP	23+	2792	View

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