SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
2012A10UF	SAMSUNG	tsop	23+	2868	View
TCSVS1A226MBAR	SAMSUNG	BGA	23+	2864	View
TCSCS1E225MBAR	SAMSUNG	SOJ	23+	2860	View
S5L9290X01-EORO	SAMSUNG	SSOP	23+	2860	View
S3F9498XZZ-A098	SAMSUNG	BGA	23+	2860	View
CL05A226MQ5QUNC	SAMSUNG	BGA	23+	2860	View
CL03C1R1BA3GNNC	SAMSUNG	TSOP48	23+	2860	View
TCSCS1E106KCAR	SAMSUNG	BGA	23+	2856	View
CL31A106KAHNNWE	SAMSUNG	BGA	23+	2856	View
CL21A106KQQN3NE	SAMSUNG	BGA	23+	2856	View
S5D2542X01-C528	SAMSUNG	TSOP	23+	2856	View
TCPCS0J107MBAR0035	SAMSUNG	BGA	23+	2852	View
S3F84H5XZZ-S095	SAMSUNG	TSOP24	23+	2852	View
S3P72P9XZZ-COC9	SAMSUNG	BGA	23+	2852	View
DFD0902F0947A	SAMSUNG	FBGA221	23+	2852	View
SLTNWW35066NDAMSSS	SAMSUNG	BGA	23+	2848	View
SFX836KC301	SAMSUNG	BGA	23+	2844	View
CPLS21D1200KLXXB	SAMSUNG	SOP	23+	2840	View
BTTM53C2RA	SAMSUNG	PGA	23+	2836	View
120647UF	SAMSUNG	BGA	23+	2832	View

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