SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
IFR27P0T0SE38	SAMSUNG	DIP	23+	2788	View
MT29F64G08CBABBWPR:B	SAMSUNG	TSOP48	23+	2784	View
AMAN542015SS122	SAMSUNG	BGA	23+	2780	View
SSR3055LATM	SAMSUNG	DIP16	23+	2776	View
H5MS5162DFR-J3M	SAMSUNG	BGA	23+	2772	View
S5F325NW02	SAMSUNG	BGA	23+	2772	View
BTEZ1702SA	SAMSUNG	BGA	23+	2768	View
SFW942PY002	SAMSUNG	DIP	23+	2764	View
RL3720WT-R010-G	SAMSUNG	TSOP	23+	2760	View
SE656MR-LF	SAMSUNG	DIP	23+	2756	View
HE12BF1U12	SAMSUNG	SOP-8	23+	2752	View
LCB21B2450Q3	SAMSUNG	TSSOP48	23+	2748	View
SWB-B85(00)	SAMSUNG	TSOP	23+	2744	View
SE1179LMRL-NT	SAMSUNG	BGA	23+	2740	View
CL31A475KBHNNNE	SAMSUNG	TSOP48	23+	2737	View
SE959LMH-LF	SAMSUNG	TSSOP	23+	2736	View
PTJCG3-02	SAMSUNG	TSOP	23+	2732	View
H8ACS0PH0MCP-56M-C	SAMSUNG	TSOP48	23+	2728	View
SE859MRH-LF	SAMSUNG	TSSOP	23+	2724	View
SPSWH1S15S1GQ09HB1	SAMSUNG	BGA	23+	2720	View

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