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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K5D5657DCC-D090 K5D5657DCC-D090 K5D5657DCC-D090 SAMSUNG QFP44 23+ 3256 View
K4E8E304EE-AGCE K4E8E304EE-AGCE K4E8E304EE-AGCE SAMSUNG QFP 23+ 3255 View
K4S511533F-YF75 K4S511533F-YF75 K4S511533F-YF75 SAMSUNG NA 23+ 3255 View
K4H510838G-LCCC K4H510838G-LCCC K4H510838G-LCCC SAMSUNG BGA 23+ 3255 View
K4B2G0846D-HYK0 K4B2G0846D-HYK0 K4B2G0846D-HYK0 SAMSUNG DIP 23+ 3255 View
K4B2G1646C-HIH9 K4B2G1646C-HIH9 K4B2G1646C-HIH9 SAMSUNG TQFP 23+ 3255 View
K4B2G1646C-HCK0 K4B2G1646C-HCK0 K4B2G1646C-HCK0 SAMSUNG BGA 23+ 3255 View
K4D263238E-GC33 K4D263238E-GC33 K4D263238E-GC33 SAMSUNG BGA 23+ 3255 View
K7N323601M-QC20 K7N323601M-QC20 K7N323601M-QC20 SAMSUNG SMD 23+ 3248 View
K5L6532ATA-D870 K5L6532ATA-D870 K5L6532ATA-D870 SAMSUNG N/A 23+ 3240 View
K4E661612D-TC60 K4E661612D-TC60 K4E661612D-TC60 SAMSUNG QFP 23+ 3234 View
K4J52324KI-JC14 K4J52324KI-JC14 K4J52324KI-JC14 SAMSUNG BGA 23+ 3234 View
K4M563233G-FN75 K4M563233G-FN75 K4M563233G-FN75 SAMSUNG QFN 23+ 3234 View
K4T1G164QF-BCE7 K4T1G164QF-BCE7 K4T1G164QF-BCE7 SAMSUNG COG 23+ 3234 View
K4B4G0846B-HCH9 K4B4G0846B-HCH9 K4B4G0846B-HCH9 SAMSUNG SMD7.2 23+ 3234 View
K4B1G0846F-HCF8 K4B1G0846F-HCF8 K4B1G0846F-HCF8 SAMSUNG SMD 23+ 3234 View
K4D261638F-LC40 K4D261638F-LC40 K4D261638F-LC40 SAMSUNG BGA 23+ 3234 View
K4H561638J-LCB3 K4H561638J-LCB3 K4H561638J-LCB3 SAMSUNG QFN 23+ 3234 View
K4D263238F-QC50 K4D263238F-QC50 K4D263238F-QC50 SAMSUNG DIP24 23+ 3234 View
K4X56323PN-8GC6 K4X56323PN-8GC6 K4X56323PN-8GC6 SAMSUNG TQFP80 23+ 3234 View