SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4T28163QP-BCE7	SAMSUNG	N/A	23+	3213	View
K4S641632D-LC60	SAMSUNG	BGA	23+	3213	View
K4T51163QQ-BCF7	SAMSUNG	SMD	23+	3213	View
K4X1G323PF-8GD8	SAMSUNG	BGA	23+	3213	View
K4B8G3346B-MCK0	SAMSUNG	QFP	23+	3213	View
K4B4G0846D-BCMA	SAMSUNG	QFN	23+	3213	View
K4D261638K-LC40	SAMSUNG	BGA272	23+	3213	View
K9LBG08UOD-PCBO	SAMSUNG	BGA	23+	3212	View
K4S641633H-BN75	SAMSUNG	QFP80	23+	3212	View
K9F4G08U0B-PCBO	SAMSUNG	QFP	23+	3208	View
K4S511632D-UC75	SAMSUNG	BGA	23+	3208	View
KA224DTF(LM224)	SAMSUNG	DIP32	23+	3204	View
K4M563233G-HN75	SAMSUNG	DIP-42	23+	3204	View
K7A803600B-PI16	SAMSUNG	TQFP-160	23+	3204	View
K9GBG08UOA-SCBO	SAMSUNG	QFP	23+	3200	View
K4T1G164QE-HCE6	SAMSUNG	chips	23+	3200	View
KLM4G2DEDD-A101	SAMSUNG	TSSOP	23+	3200	View
K4U52324QE-BC09	SAMSUNG	SOP-28	23+	3200	View
K5N6433ATM-AD11	SAMSUNG	QFP64	23+	3200	View
K5D1212ACM-S075	SAMSUNG	DIP-24	23+	3200	View

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