SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K7A403609B-QC25	SAMSUNG	DIE	23+	3200	View
K8D6316UBM-TI07	SAMSUNG	SOP-16	23+	3196	View
K4S161622E-TC80	SAMSUNG	QFP208	23+	3196	View
K8Q2815UQB-PI4B	SAMSUNG	N/A	23+	3192	View
K4T1G084QQ-HYE6000	SAMSUNG	BGA	23+	3192	View
K4B1G1646E-HCH9	SAMSUNG	SOP24	23+	3192	View
K4M56163PI-BG75	SAMSUNG	BGA	23+	3192	View
K4D551638H-LC50	SAMSUNG	BGA	23+	3192	View
K9F5608U0C-DIB0	SAMSUNG	BGA	23+	3192	View
K9F1G08UOD-SCBO	SAMSUNG	QFP208	23+	3188	View
K4S641632N-LC60	SAMSUNG	PELLET	23+	3188	View
K4T1G164QJ-BCF7	SAMSUNG	PELLET	23+	3185	View
K4B8G1646D-MYK0	SAMSUNG	QFP-160	23+	3185	View
KA8514CDTF	SAMSUNG	TQFP160	23+	3184	View
K4S560832C-TC60	SAMSUNG	QFP64	23+	3184	View
KLMCG4JETD-B041	SAMSUNG	DIP	23+	3180	View
K4G1032FG-HC04	SAMSUNG	BGA	23+	3180	View
K4T56163QI-ZCE6	SAMSUNG	DIP	23+	3178	View
K4S161622D-TC60	SAMSUNG	BGA-424	23+	3178	View
K4M51163LC-BL75000	SAMSUNG	BGA272	23+	3178	View

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