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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4B4G0846E-BYK0 K4B4G0846E-BYK0 K4B4G0846E-BYK0 SAMSUNG DIE 23+ 3409 View
K4D263238I-QC50 K4D263238I-QC50 K4D263238I-QC50 SAMSUNG QFP 23+ 3409 View
K7R641884M-FC16 K7R641884M-FC16 K7R641884M-FC16 SAMSUNG QFP44 23+ 3404 View
K3QF2F20DA-QGCF K3QF2F20DA-QGCF K3QF2F20DA-QGCF SAMSUNG QFP 23+ 3400 View
K7N321801M-QC2 K7N321801M-QC2 K7N321801M-QC2 SAMSUNG QFP 23+ 3400 View
K7R643684M-FC20 K7R643684M-FC20 K7R643684M-FC20 SAMSUNG QFP 23+ 3400 View
K6X1008C2D-TB55 K6X1008C2D-TB55 K6X1008C2D-TB55 SAMSUNG QFP 23+ 3392 View
K4T56163QO-BCE7 K4T56163QO-BCE7 K4T56163QO-BCE7 SAMSUNG QFN-48P 23+ 3388 View
K4S161622H-TC60 K4S161622H-TC60 K4S161622H-TC60 SAMSUNG LQFP-64 23+ 3388 View
K4X56323PL-8GC6 K4X56323PL-8GC6 K4X56323PL-8GC6 SAMSUNG DIP 23+ 3388 View
K4M51323PC-DG75 K4M51323PC-DG75 K4M51323PC-DG75 SAMSUNG new 23+ 3388 View
K4B40846D-EYKO K4B40846D-EYKO K4B40846D-EYKO SAMSUNG BGA 23+ 3388 View
K4B2G0846C-HCF8 K4B2G0846C-HCF8 K4B2G0846C-HCF8 SAMSUNG BGA 23+ 3388 View
K4D553235F-VC33 K4D553235F-VC33 K4D553235F-VC33 SAMSUNG BGA 23+ 3388 View
K9F2G08U0M K9F2G08U0M K9F2G08U0M SAMSUNG DIE 23+ 3388 View
K6R1008C1C-TC12 K6R1008C1C-TC12 K6R1008C1C-TC12 SAMSUNG SOP-8 23+ 3388 View
K7A801800B-HC16 K7A801800B-HC16 K7A801800B-HC16 SAMSUNG DIP-8 23+ 3384 View
K5W1213ACD-AK75 K5W1213ACD-AK75 K5W1213ACD-AK75 SAMSUNG SOP-28 23+ 3384 View
K4B4G1646D-BYK00DT K4B4G1646D-BYK00DT K4B4G1646D-BYK00DT SAMSUNG SOP 23+ 3381 View
K4X2G323PB-8GC3 K4X2G323PB-8GC3 K4X2G323PB-8GC3 SAMSUNG BGA 23+ 3360 View