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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4S641632N-LL75 K4S641632N-LL75 K4S641632N-LL75 SAMSUNG QFP 23+ 3507 View
K4B4G1646B-HCKD K4B4G1646B-HCKD K4B4G1646B-HCKD SAMSUNG QFP 23+ 3507 View
K4B4G0846E-BYMA K4B4G0846E-BYMA K4B4G0846E-BYMA SAMSUNG QFP 23+ 3507 View
K4B2G3146G-MQH9 K4B2G3146G-MQH9 K4B2G3146G-MQH9 SAMSUNG QFP 23+ 3507 View
K4D263238E-GC2A K4D263238E-GC2A K4D263238E-GC2A SAMSUNG QFP 23+ 3507 View
K9LAG08UOA-PCB0 K9LAG08UOA-PCB0 K9LAG08UOA-PCB0 SAMSUNG SOP28 23+ 3504 View
KA1000015D KA1000015D KA1000015D SAMSUNG QFP 23+ 3504 View
K6T8008C2M-TF55 K6T8008C2M-TF55 K6T8008C2M-TF55 SAMSUNG COG 23+ 3504 View
K4S161622D-TC80 K4S161622D-TC80 K4S161622D-TC80 SAMSUNG QFP 23+ 3504 View
K4H641638N-LCCC K4H641638N-LCCC K4H641638N-LCCC SAMSUNG NA 23+ 3500 View
K4D263238E-VC33 K4D263238E-VC33 K4D263238E-VC33 SAMSUNG QFP 23+ 3500 View
K4T51163QJ-HCE7 K4T51163QJ-HCE7 K4T51163QJ-HCE7 SAMSUNG DIP42 23+ 3500 View
K4D261638I-TC40 K4D261638I-TC40 K4D261638I-TC40 SAMSUNG BGA 23+ 3500 View
K9K1G08R0B-JIB0 K9K1G08R0B-JIB0 K9K1G08R0B-JIB0 SAMSUNG DIP32 23+ 3500 View
K4T51163QI-HCE6000 K4T51163QI-HCE6000 K4T51163QI-HCE6000 SAMSUNG QFP 23+ 3500 View
K5D5629CCM-F095 K5D5629CCM-F095 K5D5629CCM-F095 SAMSUNG QFP 23+ 3496 View
K9G8G08UOM-PCBO K9G8G08UOM-PCBO K9G8G08UOM-PCBO SAMSUNG QFP 23+ 3492 View
K6T4008C1B-DB55 K6T4008C1B-DB55 K6T4008C1B-DB55 SAMSUNG DIE 23+ 3492 View
K4H510838J-BCCC K4H510838J-BCCC K4H510838J-BCCC SAMSUNG NA 23+ 3486 View
K4X51163PE-FGC6 K4X51163PE-FGC6 K4X51163PE-FGC6 SAMSUNG QFP 23+ 3486 View