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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4H561638D-TCB K4H561638D-TCB K4H561638D-TCB SAMSUNG TSOP48 23+ 2600 View
KFG2G16Q2M-DEB8 KFG2G16Q2M-DEB8 KFG2G16Q2M-DEB8 SAMSUNG TSOP54 23+ 2600 View
K9K8G08U0A-PCBO K9K8G08U0A-PCBO K9K8G08U0A-PCBO SAMSUNG TSSOP 23+ 2600 View
K6F4016U6D-FF70 K6F4016U6D-FF70 K6F4016U6D-FF70 SAMSUNG NA 23+ 2600 View
K4X56163PN-VGD8 K4X56163PN-VGD8 K4X56163PN-VGD8 SAMSUNG BGA221 23+ 2600 View
K7I163682B-FC25 K7I163682B-FC25 K7I163682B-FC25 SAMSUNG TSOP48 23+ 2600 View
K7N801801B-PC16 K7N801801B-PC16 K7N801801B-PC16 SAMSUNG SOP28 23+ 2600 View
KLMCG4J1EB-B0B1 KLMCG4J1EB-B0B1 KLMCG4J1EB-B0B1 SAMSUNG BGA 23+ 2596 View
K9MDG08U1M-PIK0 K9MDG08U1M-PIK0 K9MDG08U1M-PIK0 SAMSUNG BGA 23+ 2596 View
K4H511638J-BCCC K4H511638J-BCCC K4H511638J-BCCC SAMSUNG BGA 23+ 2596 View
K3QF1F100B-PGCE K3QF1F100B-PGCE K3QF1F100B-PGCE SAMSUNG DIP 23+ 2596 View
KB100D00ZM-A453 KB100D00ZM-A453 KB100D00ZM-A453 SAMSUNG TSSOP 23+ 2592 View
K9MDG08U1M-PIBO K9MDG08U1M-PIBO K9MDG08U1M-PIBO SAMSUNG TSOP48 23+ 2592 View
K4H510438C-UCB0 K4H510438C-UCB0 K4H510438C-UCB0 SAMSUNG TSOP48 23+ 2592 View
K3UH9H90MM-AGCJ K3UH9H90MM-AGCJ K3UH9H90MM-AGCJ SAMSUNG DIP16 23+ 2592 View
K7N403601A-QC13 K7N403601A-QC13 K7N403601A-QC13 SAMSUNG SOP 23+ 2592 View
K5N6433ATB-BQ12 K5N6433ATB-BQ12 K5N6433ATB-BQ12 SAMSUNG DIP 23+ 2592 View
K9WAG08U1A-PCBO K9WAG08U1A-PCBO K9WAG08U1A-PCBO SAMSUNG TSSOP 23+ 2588 View
K9MDG08U1M-PIB0 K9MDG08U1M-PIB0 K9MDG08U1M-PIB0 SAMSUNG BGA 23+ 2588 View
K4H510838J-BCCC00 K4H510838J-BCCC00 K4H510838J-BCCC00 SAMSUNG TSOP48 23+ 2588 View