SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K5E1212ACC-D075T	SAMSUNG	TSOP	23+	2632	View
K5R2G1GACC-AL75	SAMSUNG	LBGA	23+	2632	View
K7B403625M-QC90	SAMSUNG	DIP16	23+	2632	View
K3MF8F80DM-MGCF	SAMSUNG	TSOP	23+	2632	View
K9GAG08UOD-PIBO	SAMSUNG	BGA	23+	2628	View
K9F5608U0D-FIB0	SAMSUNG	TSOP48	23+	2628	View
K4AAG165WA-BCWE	SAMSUNG	BGA	23+	2628	View
K7K3236T2C-EC40	SAMSUNG	BGA	23+	2628	View
K9F5608UOB-PCBO	SAMSUNG	TSOP-40	23+	2624	View
K9F1G08U0A-PCB0	SAMSUNG	TSOP-40	23+	2624	View
K4E641612E-TP50	SAMSUNG	TSOP	23+	2624	View
KM681001BSJ-15	SAMSUNG	BGA	23+	2624	View
K7N643645M-PC16	SAMSUNG	TSOP	23+	2624	View
K7R161882B-FC20	SAMSUNG	TO-126F	23+	2624	View
KM684000BLP-7	SAMSUNG	TSOP48	23+	2620	View
K9F1G08UOD-SIBO	SAMSUNG	SOJ44	23+	2620	View
K4T51163QE-ZCD5	SAMSUNG	BGA	23+	2620	View
K4E160812D-BC50	SAMSUNG	DIP24	23+	2618	View
K4W1G1646E-HC11	SAMSUNG	BGA	23+	2618	View
K4M56323LG-HN75000	SAMSUNG	BGA	23+	2618	View