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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4A4G165WE-BIRC K4A4G165WE-BIRC K4A4G165WE-BIRC SAMSUNG TSOP 23+ 1984 View
KM681002J-15 KM681002J-15 KM681002J-15 SAMSUNG TSOP 23+ 1980 View
K9HAG08U1M-PCB0 K9HAG08U1M-PCB0 K9HAG08U1M-PCB0 SAMSUNG TSOP 23+ 1980 View
KMR31000BA-B614 KMR31000BA-B614 KMR31000BA-B614 SAMSUNG TSOP-54 23+ 1980 View
KM41C464J-8 KM41C464J-8 KM41C464J-8 SAMSUNG BGA 23+ 1980 View
KC73129-BW KC73129-BW KC73129-BW SAMSUNG BGA 23+ 1980 View
K9MDG08U5M-PCKO K9MDG08U5M-PCKO K9MDG08U5M-PCKO SAMSUNG BGA 23+ 1980 View
KAT007032M-ARTT KAT007032M-ARTT KAT007032M-ARTT SAMSUNG TSOP 23+ 1980 View
K9K8G08U0M-PCBO K9K8G08U0M-PCBO K9K8G08U0M-PCBO SAMSUNG BGA 23+ 1980 View
KM616V4002BT-10T KM616V4002BT-10T KM616V4002BT-10T SAMSUNG SOP 23+ 1980 View
KS57C2102-22D KS57C2102-22D KS57C2102-22D SAMSUNG BGA 23+ 1980 View
K7P403622B-HC20 K7P403622B-HC20 K7P403622B-HC20 SAMSUNG BGA 23+ 1980 View
K6T1008C2C-DB70 K6T1008C2C-DB70 K6T1008C2C-DB70 SAMSUNG BGA 23+ 1980 View
K6X4008C1F-VB70 K6X4008C1F-VB70 K6X4008C1F-VB70 SAMSUNG BGA 23+ 1980 View
K6X4008C1F-BF55 K6X4008C1F-BF55 K6X4008C1F-BF55 SAMSUNG BGA 23+ 1980 View
K6R4016V1D-KI10 K6R4016V1D-KI10 K6R4016V1D-KI10 SAMSUNG FBGA 23+ 1980 View
K4EBE304EB-EGCF K4EBE304EB-EGCF K4EBE304EB-EGCF SAMSUNG FBGA 23+ 1980 View
K4T1G164QF-BCE70JP K4T1G164QF-BCE70JP K4T1G164QF-BCE70JP SAMSUNG TSOP 23+ 1980 View
K4W2G1646C-HC12 K4W2G1646C-HC12 K4W2G1646C-HC12 SAMSUNG BGA 23+ 1980 View
K5W2G1HACI-BP50 K5W2G1HACI-BP50 K5W2G1HACI-BP50 SAMSUNG SOP 23+ 1980 View