SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4G10325FG-HC04	SAMSUNG	TSOP66	23+	1948	View
K9K1G08UOB-JIBO	SAMSUNG	SOP	23+	1944	View
K4H510838D-UCCC	SAMSUNG	SOP	23+	1944	View
K5L2731CAA-D770	SAMSUNG	BGA	23+	1944	View
K5W2G13ACM-DK60	SAMSUNG	SSOP	23+	1944	View
K5W1258ACM-AK75	SAMSUNG	BGA	23+	1944	View
K9F1G08U0D-SCB0000	SAMSUNG	BGA	23+	1940	View
K4P8G304EB-FGC1	SAMSUNG	SOP	23+	1940	View
KAV00N002M-ARR7	SAMSUNG	BGA	23+	1936	View
K9ABG08UOA-MCBO	SAMSUNG	BGA-200	23+	1936	View
KM41C1000DZ-7	SAMSUNG	BGA	23+	1936	View
K9F5616U0C-PIBO	SAMSUNG	FBGA90	23+	1936	View
K8D1716UBC-PI07	SAMSUNG	FBGA	23+	1936	View
K9F1208ROB-JIBO	SAMSUNG	BGA	23+	1936	View
KA431DTF	SAMSUNG	TSOP	23+	1936	View
K9K1G08UOA-PIBO	SAMSUNG	BGA	23+	1936	View
K9F6408U0C-TIB0	SAMSUNG	TSOP-54	23+	1936	View
K9F6408U0C-TCBO	SAMSUNG	FBGA60	23+	1936	View
K7R321882M-EC25	SAMSUNG	TSOP	23+	1936	View
K6T008U2E-YF10	SAMSUNG	TSOP	23+	1936	View

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