SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K6X0808C1D-BF70	SAMSUNG	BGA	23+	1936	View
K6R1016C1D-TC10	SAMSUNG	BGA	23+	1936	View
K6R1016V1D-TC10	SAMSUNG	SOP-50	23+	1936	View
K4H511638D-ZCCC	SAMSUNG	TSOP54	23+	1936	View
K4M513233E-ML1L	SAMSUNG	TSOP	23+	1936	View
K4E151611C-TC45	SAMSUNG	BGA	23+	1936	View
K7R643682M-FC20	SAMSUNG	TSOP	23+	1936	View
K9NCG08U5M-PCBO	SAMSUNG	FBGA	23+	1932	View
K4S561632B-TC75	SAMSUNG	BGA	23+	1932	View
K9T1G08UOM-PIBO	SAMSUNG	BGA	23+	1928	View
KM62256CLRG-7L	SAMSUNG	BGA	23+	1928	View
KAP17SG00A-D4U4	SAMSUNG	BGA	23+	1928	View
KM44C4100ALS-7	SAMSUNG	SSOP	23+	1928	View
K4M563223PG-HG75	SAMSUNG	TSOP-66	23+	1928	View
K4X1G163PE	SAMSUNG	BGA	23+	1928	View
K4U6E3S4AM-MGCJ	SAMSUNG	BGA	23+	1928	View
K4S51063LD-TC75	SAMSUNG	BGA	23+	1928	View
K9T1G08UOM-PIB0	SAMSUNG	BGA	23+	1924	View
K4E640412D-JC60	SAMSUNG	TSOP	23+	1924	View
K9T1G08U0M-PIBO	SAMSUNG	FBGA	23+	1920	View

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