SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
HED54XXU11	SAMSUNG	BGA78	23+	1960	View
S5L8420X01-Y080	SAMSUNG	BGA	23+	1960	View
S524C80D41-DCB0	SAMSUNG	FBGA	23+	1960	View
S3C4510B01-QER	SAMSUNG	BGA	23+	1960	View
S3C2500B01	SAMSUNG	BGA	23+	1960	View
S3C8245AH8-TW85	SAMSUNG	TSOP	23+	1960	View
S3P825AXZZ-TW8A	SAMSUNG	BGA	23+	1960	View
CIL10N82NMNC	SAMSUNG	BGA	23+	1960	View
S1L9223B01-Q0	SAMSUNG	FBGA	23+	1960	View
CL21C0R5CBANNNC	SAMSUNG	FBGA54	23+	1960	View
CL21B221KBANNNC	SAMSUNG	BGA	23+	1960	View
CL10C470JB8NNNC 0603 47P 50V	SAMSUNG	TSSOP	23+	1960	View
CL31A106KQHNNNE	SAMSUNG	TSSOP	23+	1960	View
CL05C101JB5NNNC	SAMSUNG	BGA	23+	1960	View
CL21A106MPFNNNE	SAMSUNG	BGA	23+	1960	View
CL03A104MQ3NNNC	SAMSUNG	BGA	23+	1960	View
CIGT2016R6TA1R0MBM	SAMSUNG	BGA	23+	1960	View
HE12AF1U12	SAMSUNG	TSOP66	23+	1956	View
DX21TFAP01	SAMSUNG	BGA	23+	1952	View
TC524256Z-80	SAMSUNG	TSSOP	23+	1948	View

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