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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
SE919LM-NT SE919LM-NT SE919LM-NT SAMSUNG BGA 23+ 1948 View
SE859MD-LF SE859MD-LF SE859MD-LF SAMSUNG TSOP 23+ 1948 View
SABC505-CA SABC505-CA SABC505-CA SAMSUNG TSOP 23+ 1948 View
2N7002K2DW 2N7002K2DW 2N7002K2DW SAMSUNG BGA 23+ 1948 View
S5E4412ACO-LA40 S5E4412ACO-LA40 S5E4412ACO-LA40 SAMSUNG TSOP 23+ 1948 View
S5H1420X01-E0RZ S5H1420X01-E0RZ S5H1420X01-E0RZ SAMSUNG BGA 23+ 1948 View
S3C2800X01-EERO S3C2800X01-EERO S3C2800X01-EERO SAMSUNG TSOP 23+ 1948 View
S3F84K4XZZ-SK94 S3F84K4XZZ-SK94 S3F84K4XZZ-SK94 SAMSUNG TQFP 23+ 1948 View
S3C80F9BKA-S077 S3C80F9BKA-S077 S3C80F9BKA-S077 SAMSUNG TSOP66 23+ 1948 View
S3P72E8DZZ-COC8 S3P72E8DZZ-COC8 S3P72E8DZZ-COC8 SAMSUNG BGA 23+ 1948 View
S3F8S15XZZ-QR85 S3F8S15XZZ-QR85 S3F8S15XZZ-QR85 SAMSUNG TSOP66 23+ 1948 View
S1L9292X01 S1L9292X01 S1L9292X01 SAMSUNG BGA 23+ 1948 View
CL10B222JB8NNNC CL10B222JB8NNNC CL10B222JB8NNNC SAMSUNG BGA 23+ 1948 View
CL10A106K08NNNC CL10A106K08NNNC CL10A106K08NNNC SAMSUNG TSOP-54 23+ 1948 View
CL21A106KOFNNNE CL21A106KOFNNNE CL21A106KOFNNNE SAMSUNG BGA 23+ 1948 View
CL10B104JB8NNNC CL10B104JB8NNNC CL10B104JB8NNNC SAMSUNG BGA 23+ 1948 View
CL21C820JC61PNC CL21C820JC61PNC CL21C820JC61PNC SAMSUNG BGA 23+ 1948 View
CL03A105KQ3CSNC CL03A105KQ3CSNC CL03A105KQ3CSNC SAMSUNG BGA 23+ 1948 View
CL10B102KB8NNNC CL10B102KB8NNNC CL10B102KB8NNNC SAMSUNG BGA 23+ 1948 View
CIG21E2R2MNE CIG21E2R2MNE CIG21E2R2MNE SAMSUNG FBGA96 23+ 1948 View